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    Diffusion bonding between Ti-6Al-4V alloy and microduplex stainless steel with copper interlayer

    New search for: Eroglu, M.
    New search for: Khan, T. I.
    New search for: Orhan, N.

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    Diffusion bonding between Ti-6Al-4V alloy and microduplex stainless steel with copper interlayer

    New search for: Eroglu, M.
    New search for: Khan, T. I.
    New search for: Orhan, N.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Diffusion bonding between Ti-6Al-4V alloy and microduplex stainless steel with copper interlayer

    New search for: Eroglu, M.
    New search for: Khan, T. I.
    New search for: Orhan, N.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
    Similar titles

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    Document information
    Title:

    Diffusion bonding between Ti-6Al-4V alloy and microduplex stainless steel with copper interlayer

    Contributors:

    Eroglu, M. (author) / Khan, T. I. (author) / Orhan, N. (author)

    Published in:

    MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 18 ; 68-72

    Publication date:

    2002-01-01

    Size:

    5 pages

    ISSN:

    0267-0836

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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