Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Diffusion Bonding of Duplex Stainless Steel and Ti Alloy with and without Interlayer

    New search for: Chatterjee, S.
    New search for: Kundu, S.
    New search for: Sam, S.
    New search for: Mishra, B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Diffusion Bonding of Duplex Stainless Steel and Ti Alloy with and without Interlayer

    New search for: Chatterjee, S.
    New search for: Kundu, S.
    New search for: Sam, S.
    New search for: Mishra, B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Diffusion Bonding of Duplex Stainless Steel and Ti Alloy with and without Interlayer

    New search for: Chatterjee, S.
    New search for: Kundu, S.
    New search for: Sam, S.
    New search for: Mishra, B.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Diffusion Bonding of Duplex Stainless Steel and Ti Alloy with and without Interlayer

    Contributors:

    Chatterjee, S. (author) / Kundu, S. (author) / Sam, S. (author) / Mishra, B. (author)

    Published in:

    MATERIALS SCIENCE FORUM ; 783/786 ; 9-14

    Publication date:

    2014-01-01

    Size:

    6 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Diffusion bonding of titanium alloy to micro-duplex stainless steel using a nickel alloy interlayer: Interface microstructure and strength properties

    Sam, S. / Kundu, S. / Chatterjee, S. | British Library Online Contents | 2012

    Diffusion bonding of titanium alloy to micro-duplex stainless steel using a nickel alloy interlayer: Interface microstructure and strength properties

    Sam, S. / Kundu, S. / Chatterjee, S. | Elsevier | 2012

    Impulse pressuring diffusion bonding of a copper alloy to a stainless steel with/without a pure nickel interlayer

    Yuan, Xinjian / Tang, Kunlun / Deng, Yongqiang et al. | British Library Online Contents | 2013

    Impulse pressuring diffusion bonding of a copper alloy to a stainless steel with/without a pure nickel interlayer

    Yuan, Xinjian / Tang, Kunlun / Deng, Yongqiang et al. | Elsevier | 2013

    Impulse pressuring diffusion bonding of a copper alloy to a stainless steel with/without a pure nickel interlayer

    Yuan, X. / Tang, K. / Deng, Y. et al. | British Library Online Contents | 2013

    Back to top