Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders: Fid-Bau Portal

Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders

Chen, W. T. / Ho, C. E. / Kao, C. R.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders

Chen, W. T. / Ho, C. E. / Kao, C. R.

Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders

Chen, W. T. / Ho, C. E. / Kao, C. R.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders

Contributors:

Chen, W. T. (author) / Ho, C. E. (author) / Kao, C. R. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 17 ; 263-266

Publication date:

2002-01-01

Size:

4 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Laurila, T. / Vuorinen, V. / Kivilahti, J. K. | British Library Online Contents | 2005

Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu

Yang, S. C. / Ho, C. E. / Chang, C. W. et al. | British Library Online Contents | 2006

Interfacial reactions between lead-free solders and the multilayer Au/Ni/SUS304 substrate

Yen, Y.-W. / Lee, C.-Y. / Kuo, M.-H. et al. | British Library Online Contents | 2009

Interfacial reactions between Sn-Cu solders and Ni-Co alloys at 250 ^oC

Chen, C.-C. / Chan, Y.-T. / Chen, Y.-T. | British Library Online Contents | 2010

Interfacial Reaction and Morphology Between Molten Sn Base Solders and Cu Substrate

Takaku, Y. / Liu, X. J. / Ohnuma, I. et al. | British Library Online Contents | 2004