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Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders

Chen, W. T. / Ho, C. E. / Kao, C. R.

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Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders

Chen, W. T. / Ho, C. E. / Kao, C. R.

Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders

Chen, W. T. / Ho, C. E. / Kao, C. R.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders

Contributors:

Chen, W. T. (author) / Ho, C. E. (author) / Kao, C. R. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 17 ; 263-266

Publication date:

2002-01-01

Size:

4 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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