Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders
Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders
Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders
Chen, W. T. (Autor:in) / Ho, C. E. (Autor:in) / Kao, C. R. (Autor:in)
JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 17 ; 263-266
01.01.2002
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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