Interfacial reactions between lead-free solders and the multilayer Au/Ni/SUS304 substrate: Fid-Bau Portal

Interfacial reactions between lead-free solders and the multilayer Au/Ni/SUS304 substrate

Yen, Y.-W. / Lee, C.-Y. / Kuo, M.-H. / Chao, K.-S. / Chen, K.-D.

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Interfacial reactions between lead-free solders and the multilayer Au/Ni/SUS304 substrate

Yen, Y.-W. / Lee, C.-Y. / Kuo, M.-H. / Chao, K.-S. / Chen, K.-D.

Interfacial reactions between lead-free solders and the multilayer Au/Ni/SUS304 substrate

Yen, Y.-W. / Lee, C.-Y. / Kuo, M.-H. / Chao, K.-S. / Chen, K.-D.

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Check availability in my library

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Document information

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Document information

Title:

Interfacial reactions between lead-free solders and the multilayer Au/Ni/SUS304 substrate

Contributors:

Yen, Y.-W. (author) / Lee, C.-Y. (author) / Kuo, M.-H. (author) / Chao, K.-S. (author) / Chen, K.-D. (author)

Published in:

INTERNATIONAL JOURNAL OF MATERIALS RESEARCH ; 100 ; 672-676

Publication date:

2009-01-01

Size:

5 pages

ISSN:

1862-5282

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 669.9

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