A platform for research: civil engineering, architecture and urbanism
The influence of copper nanopowders on microstructure and hardness of lead-tin solder
The influence of copper nanopowders on microstructure and hardness of lead-tin solder
The influence of copper nanopowders on microstructure and hardness of lead-tin solder
Lin, D. (author) / Wang, G. X. (author) / Srivatsan, T. S. (author) / Al-Hajri, M. (author) / Petraroli, M. (author)
MATERIALS LETTERS ; 53 ; 333-338
2002-01-01
6 pages
Article (Journal)
English
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
British Library Online Contents | 2002
|British Library Online Contents | 2003
|Influence of Bi on microstructure and properties of Sn-Zn lead-free solder
British Library Online Contents | 2010
|Effect of copper addition on the microstructure and mechanical properties of lead free solder alloy
British Library Online Contents | 2007
|Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder
British Library Online Contents | 2010
|