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Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder
Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder
Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder
Tsao, L. C. (author) / Chang, S. Y. (author) / Lee, C. I. (author) / Sun, W. H. (author) / Huang, C. H. (author)
MATERIALS AND DESIGN -REIGATE- ; 31 ; 4831-4835
2010-01-01
5 pages
Article (Journal)
English
DDC:
620.0042
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