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    Grain Boundary Triple Junction Effects on the Fatigue Deformation and Cracking Behaviros of Copper Tricrystal and Tetracrystals

    New search for: Jia, W.
    New search for: Zhu, Z.
    New search for: Wang, Z.
    New search for: Li, S.

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    Grain Boundary Triple Junction Effects on the Fatigue Deformation and Cracking Behaviros of Copper Tricrystal and Tetracrystals

    New search for: Jia, W.
    New search for: Zhu, Z.
    New search for: Wang, Z.
    New search for: Li, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Grain Boundary Triple Junction Effects on the Fatigue Deformation and Cracking Behaviros of Copper Tricrystal and Tetracrystals

    New search for: Jia, W.
    New search for: Zhu, Z.
    New search for: Wang, Z.
    New search for: Li, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Grain Boundary Triple Junction Effects on the Fatigue Deformation and Cracking Behaviros of Copper Tricrystal and Tetracrystals

    Contributors:

    Jia, W. (author) / Zhu, Z. (author) / Wang, Z. (author) / Li, S. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE AND TECHNOLOGY -SHENYANG- ; 18 ; 108-112

    Publication date:

    2002-01-01

    Size:

    5 pages

    ISSN:

    1005-0302

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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