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    Dynamic Recrystallization at Triple Junction during High-Temperature Deformation in Copper Tricrystal

    New search for: Andiarwanto, S.
    New search for: Miura, H.
    New search for: Sakai, T.
    New search for: Lee, D. N.

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    Dynamic Recrystallization at Triple Junction during High-Temperature Deformation in Copper Tricrystal

    New search for: Andiarwanto, S.
    New search for: Miura, H.
    New search for: Sakai, T.
    New search for: Lee, D. N.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Dynamic Recrystallization at Triple Junction during High-Temperature Deformation in Copper Tricrystal

    New search for: Andiarwanto, S.
    New search for: Miura, H.
    New search for: Sakai, T.
    New search for: Lee, D. N.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Dynamic Recrystallization at Triple Junction during High-Temperature Deformation in Copper Tricrystal

    Contributors:

    Andiarwanto, S. (author) / Miura, H. (author) / Sakai, T. (author) / Lee, D. N.

    Published in:

    Textures of Materials ICOTOM 13 Part 1 ; 761-766

    MATERIALS SCIENCE FORUM ; 408/412

    Publication date:

    2002-01-01

    Size:

    6 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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