Fatigue behaviors of a copper tricrystal Part II Crystallographic fatigue crack growth in the vicinity of the triple junction: Fid-Bau Portal

Fatigue behaviors of a copper tricrystal Part II Crystallographic fatigue crack growth in the vicinity of the triple junction

Jia, W. P. / Li, S. X. / Wang, Z. G. / Li, G. Y.

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Fatigue behaviors of a copper tricrystal Part II Crystallographic fatigue crack growth in the vicinity of the triple junction

Jia, W. P. / Li, S. X. / Wang, Z. G. / Li, G. Y.

Fatigue behaviors of a copper tricrystal Part II Crystallographic fatigue crack growth in the vicinity of the triple junction

Jia, W. P. / Li, S. X. / Wang, Z. G. / Li, G. Y.

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Check availability in my library

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Document information

Title:

Fatigue behaviors of a copper tricrystal Part II Crystallographic fatigue crack growth in the vicinity of the triple junction

Contributors:

Jia, W. P. (author) / Li, S. X. (author) / Wang, Z. G. (author) / Li, G. Y. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE LETTERS ; 17 ; 1041-1044

Publication date:

1998-01-01

Size:

4 pages

ISSN:

0261-8028

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Jia, W. P. / Li, S. X. / Wang, Z. G. et al. | British Library Online Contents | 1998

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Andiarwanto, S. / Miura, H. / Sakai, T. | British Library Online Contents | 2002

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Strain Rate Effect on Dynamic Nucleation at Triple Junctions in a Copper Tricrystal

Andiarwanto, S. / Miura, H. / Sakai, T. | British Library Online Contents | 2003