Adhesion of Cu and low-k dielectric thin films with tungsten carbide: Fid-Bau Portal

Adhesion of Cu and low-k dielectric thin films with tungsten carbide

Lemonds, A. M. / Kershen, K. / Bennett, J. / Pfeifer, K. / Sun, Y.-M. / White, J. M. / Ekerdt, J. G.

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Adhesion of Cu and low-k dielectric thin films with tungsten carbide

Lemonds, A. M. / Kershen, K. / Bennett, J. / Pfeifer, K. / Sun, Y.-M. / White, J. M. / Ekerdt, J. G.

Adhesion of Cu and low-k dielectric thin films with tungsten carbide

Lemonds, A. M. / Kershen, K. / Bennett, J. / Pfeifer, K. / Sun, Y.-M. / White, J. M. / Ekerdt, J. G.

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Check availability in my library

Order at Subito €

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Document information

Title:

Adhesion of Cu and low-k dielectric thin films with tungsten carbide

Contributors:

Lemonds, A. M. (author) / Kershen, K. (author) / Bennett, J. (author) / Pfeifer, K. (author) / Sun, Y.-M. (author) / White, J. M. (author) / Ekerdt, J. G. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 17 ; 1320-1328

Publication date:

2002-01-01

Size:

9 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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