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    Grain-boundary voiding in self-passivated Cu-1 at.% Al alloy films on Si substrates

    New search for: Weiss, D.
    New search for: Kraft, O.
    New search for: Arzt, E.

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    Grain-boundary voiding in self-passivated Cu-1 at.% Al alloy films on Si substrates

    New search for: Weiss, D.
    New search for: Kraft, O.
    New search for: Arzt, E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Grain-boundary voiding in self-passivated Cu-1 at.% Al alloy films on Si substrates

    New search for: Weiss, D.
    New search for: Kraft, O.
    New search for: Arzt, E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Title:

    Grain-boundary voiding in self-passivated Cu-1 at.% Al alloy films on Si substrates

    Contributors:

    Weiss, D. (author) / Kraft, O. (author) / Arzt, E. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 17 ; 1363-1370

    Publication date:

    2002-01-01

    Size:

    8 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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