Stress evolution in passivated thin films of Cu on silica substrates: Fid-Bau Portal

Stress evolution in passivated thin films of Cu on silica substrates

Shen, Y.-L. / Suresh, S. / He, M. Y. / Bagchi, A. / Kienzle, O. / Ruehle, M. / Evans, A. G.

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Stress evolution in passivated thin films of Cu on silica substrates

Shen, Y.-L. / Suresh, S. / He, M. Y. / Bagchi, A. / Kienzle, O. / Ruehle, M. / Evans, A. G.

Stress evolution in passivated thin films of Cu on silica substrates

Shen, Y.-L. / Suresh, S. / He, M. Y. / Bagchi, A. / Kienzle, O. / Ruehle, M. / Evans, A. G.

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Document information

Title:

Stress evolution in passivated thin films of Cu on silica substrates

Contributors:

Shen, Y.-L. (author) / Suresh, S. (author) / He, M. Y. (author) / Bagchi, A. (author) / Kienzle, O. (author) / Ruehle, M. (author) / Evans, A. G. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 13 ; 1928-1937

Publication date:

1998-01-01

Size:

10 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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