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    Influence of intermetallic compounds on the adhesive strength of solder joints

    New search for: Lee, H. T.
    New search for: Chen, M. H.

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    Influence of intermetallic compounds on the adhesive strength of solder joints

    New search for: Lee, H. T.
    New search for: Chen, M. H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Influence of intermetallic compounds on the adhesive strength of solder joints

    New search for: Lee, H. T.
    New search for: Chen, M. H.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Influence of intermetallic compounds on the adhesive strength of solder joints

    Contributors:

    Lee, H. T. (author) / Chen, M. H. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A -LAUSANNE- ; 333 ; 24 - 34

    Publication date:

    2002-01-01

    Size:

    11 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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