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    Morphologies and grain orientations of Cu–Sn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints

    New search for: Liu, W.
    New search for: Tian, Y.
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    New search for: Liu, R.

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    Morphologies and grain orientations of Cu–Sn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints

    New search for: Liu, W.
    New search for: Tian, Y.
    New search for: Wang, C.
    New search for: Wang, X.
    New search for: Liu, R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Morphologies and grain orientations of Cu–Sn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints

    New search for: Liu, W.
    New search for: Tian, Y.
    New search for: Wang, C.
    New search for: Wang, X.
    New search for: Liu, R.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Morphologies and grain orientations of Cu–Sn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints

    Contributors:

    Liu, W. (author) / Tian, Y. (author) / Wang, C. (author) / Wang, X. (author) / Liu, R. (author)

    Published in:

    MATERIALS LETTERS ; 86 ; 157-160

    Publication date:

    2012-01-01

    Size:

    4 pages

    ISSN:

    0167-577X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1105 / 530

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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