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Grain morphology of intermetallic compounds at solder joints

Choi, W. K. / Jang, S.-Y. / Kim, J. H. / Paik, K.-W. / Lee, H. M.

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Grain morphology of intermetallic compounds at solder joints

Choi, W. K. / Jang, S.-Y. / Kim, J. H. / Paik, K.-W. / Lee, H. M.

Grain morphology of intermetallic compounds at solder joints

Choi, W. K. / Jang, S.-Y. / Kim, J. H. / Paik, K.-W. / Lee, H. M.

Access

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Grain morphology of intermetallic compounds at solder joints

Contributors:

Choi, W. K. (author) / Jang, S.-Y. (author) / Kim, J. H. (author) / Paik, K.-W. (author) / Lee, H. M. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 17 ; 597-599

Publication date:

2002-01-01

Size:

3 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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