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    Interfacial microstructure evolution between eutectic SnAgCu solder and Al/Ni(V)/Cu thin films

    New search for: Li, M.
    New search for: Zhang, F.
    New search for: Chen, W. T.
    New search for: Zeng, K.
    New search for: Tu, K. N.
    New search for: Balkan, H.
    New search for: Elenius, P.

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    Interfacial microstructure evolution between eutectic SnAgCu solder and Al/Ni(V)/Cu thin films

    New search for: Li, M.
    New search for: Zhang, F.
    New search for: Chen, W. T.
    New search for: Zeng, K.
    New search for: Tu, K. N.
    New search for: Balkan, H.
    New search for: Elenius, P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Interfacial microstructure evolution between eutectic SnAgCu solder and Al/Ni(V)/Cu thin films

    New search for: Li, M.
    New search for: Zhang, F.
    New search for: Chen, W. T.
    New search for: Zeng, K.
    New search for: Tu, K. N.
    New search for: Balkan, H.
    New search for: Elenius, P.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Interfacial microstructure evolution between eutectic SnAgCu solder and Al/Ni(V)/Cu thin films

    Contributors:

    Li, M. (author) / Zhang, F. (author) / Chen, W. T. (author) / Zeng, K. (author) / Tu, K. N. (author) / Balkan, H. (author) / Elenius, P. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 17 ; 1612-1621

    Publication date:

    2002-01-01

    Size:

    10 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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