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    Microstructure evolution based acceleration factor determination for SnAgCu solder joints during thermal cycling

    New search for: Tunga, Krishna
    New search for: Sitaraman, Suresh K.

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    Microstructure evolution based acceleration factor determination for SnAgCu solder joints during thermal cycling

    New search for: Tunga, Krishna
    New search for: Sitaraman, Suresh K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Microstructure evolution based acceleration factor determination for SnAgCu solder joints during thermal cycling

    New search for: Tunga, Krishna
    New search for: Sitaraman, Suresh K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Microstructure evolution based acceleration factor determination for SnAgCu solder joints during thermal cycling

    Contributors:

    Tunga, Krishna (author) / Sitaraman, Suresh K. (author)

    Published in:

    International journal of materials and structural integrity ; 2 ; 173-192

    Publication date:

    2008-01-01

    Size:

    20 pages

    ISSN:

    1745-0055

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.112

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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