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Texture Analysis of Copper Bonding Wire

Baeck, S. M. / Park, K. K. / Ha, H. / Oh, Y. / Park, Y. / Moon, J. T. / Lee, J. / Oh, K. H.

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Texture Analysis of Copper Bonding Wire

Baeck, S. M. / Park, K. K. / Ha, H. / Oh, Y. / Park, Y. / Moon, J. T. / Lee, J. / Oh, K. H.

Texture Analysis of Copper Bonding Wire

Baeck, S. M. / Park, K. K. / Ha, H. / Oh, Y. / Park, Y. / Moon, J. T. / Lee, J. / Oh, K. H.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Texture Analysis of Copper Bonding Wire

Contributors:

Baeck, S. M. (author) / Park, K. K. (author) / Ha, H. (author) / Oh, Y. (author) / Park, Y. (author) / Moon, J. T. (author) / Lee, J. (author) / Oh, K. H. (author) / Lee, D. N.

Published in:

Textures of Materials ICOTOM 13 Part 1 ; 803-808

MATERIALS SCIENCE FORUM ; 408/412

Publication date:

2002-01-01

Size:

6 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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