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    Fundamentals of thermo-sonic copper wire bonding in microelectronics packaging

    New search for: Murali, S.
    New search for: Srikanth, N.
    New search for: Wong, Y. M.
    New search for: Vath, C. J.

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    Fundamentals of thermo-sonic copper wire bonding in microelectronics packaging

    New search for: Murali, S.
    New search for: Srikanth, N.
    New search for: Wong, Y. M.
    New search for: Vath, C. J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Fundamentals of thermo-sonic copper wire bonding in microelectronics packaging

    New search for: Murali, S.
    New search for: Srikanth, N.
    New search for: Wong, Y. M.
    New search for: Vath, C. J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Fundamentals of thermo-sonic copper wire bonding in microelectronics packaging

    Contributors:

    Murali, S. (author) / Srikanth, N. (author) / Wong, Y. M. (author) / Vath, C. J. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 42 ; 615-623

    Publication date:

    2007-01-01

    Size:

    9 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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