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    Creep behavior of eutectic Sn-Ag lead-free solder alloy

    New search for: Huang, M. L.
    New search for: Wang, L.
    New search for: Wu, C. M. L.

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    Creep behavior of eutectic Sn-Ag lead-free solder alloy

    New search for: Huang, M. L.
    New search for: Wang, L.
    New search for: Wu, C. M. L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Creep behavior of eutectic Sn-Ag lead-free solder alloy

    New search for: Huang, M. L.
    New search for: Wang, L.
    New search for: Wu, C. M. L.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Creep behavior of eutectic Sn-Ag lead-free solder alloy

    Contributors:

    Huang, M. L. (author) / Wang, L. (author) / Wu, C. M. L. (author)

    Published in:

    JOURNAL OF MATERIALS RESEARCH -PITTSBURGH- ; 17 ; 2897-2903

    Publication date:

    2002-01-01

    Size:

    7 pages

    ISSN:

    0884-2914

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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