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    Enhancement of creep resistance and thermal behavior of eutectic Sn-Cu lead-free solder alloy by Ag and In-additions

    New search for: El-Daly, A. A.
    New search for: Hammad, A. E.

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    Enhancement of creep resistance and thermal behavior of eutectic Sn-Cu lead-free solder alloy by Ag and In-additions

    New search for: El-Daly, A. A.
    New search for: Hammad, A. E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Enhancement of creep resistance and thermal behavior of eutectic Sn-Cu lead-free solder alloy by Ag and In-additions

    New search for: El-Daly, A. A.
    New search for: Hammad, A. E.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

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    Check availability in my library
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    Similar titles

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    Document information
    Title:

    Enhancement of creep resistance and thermal behavior of eutectic Sn-Cu lead-free solder alloy by Ag and In-additions

    Contributors:

    El-Daly, A. A. (author) / Hammad, A. E. (author)

    Published in:

    MATERIALS AND DESIGN -REIGATE- ; 40 ; 292-298

    Publication date:

    2012-01-01

    Size:

    7 pages

    ISSN:

    0261-3069

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.0042

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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