Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    BGA Solder Joints

    New search for: Kongcharoen, A.
    New search for: Trongjitwikrai, S.
    New search for: Netphu, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    BGA Solder Joints

    New search for: Kongcharoen, A.
    New search for: Trongjitwikrai, S.
    New search for: Netphu, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    BGA Solder Joints

    New search for: Kongcharoen, A.
    New search for: Trongjitwikrai, S.
    New search for: Netphu, S.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    BGA Solder Joints

    Contributors:

    Kongcharoen, A. (author) / Trongjitwikrai, S. (author) / Netphu, S. (author)

    Published in:

    ADVANCED PACKAGING ; 11 ; 23-28

    Publication date:

    2002-01-01

    Size:

    6 pages

    ISSN:

    1065-0555

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  658.564

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Thermomigration in solder joints

    Chen, C. / Hsiao, H. Y. / Chang, Y. W. et al. | British Library Online Contents | 2012

    Reliability of Solder Joints

    Frear, D. R. / Yost, F. G. | British Library Online Contents | 1993

    Fracture of CSP Solder Joints

    Katchmar, R. | British Library Online Contents | 1999

    Properties of Solder Joints Using Sn-Ag-Bi-In Solder

    Yamaguchi, A. / Yamashita, Y. / Furusawa, A. et al. | British Library Online Contents | 2004

    Recrystallization behaviour of SnAgCu solder joints

    Sundelin, J. J. / Nurmi, S. T. / Lepisto, T. K. | British Library Online Contents | 2008

    Back to top