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    Recrystallization behaviour of SnAgCu solder joints

    New search for: Sundelin, J. J.
    New search for: Nurmi, S. T.
    New search for: Lepisto, T. K.

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    Recrystallization behaviour of SnAgCu solder joints

    New search for: Sundelin, J. J.
    New search for: Nurmi, S. T.
    New search for: Lepisto, T. K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Recrystallization behaviour of SnAgCu solder joints

    New search for: Sundelin, J. J.
    New search for: Nurmi, S. T.
    New search for: Lepisto, T. K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Recrystallization behaviour of SnAgCu solder joints

    Contributors:

    Sundelin, J. J. (author) / Nurmi, S. T. (author) / Lepisto, T. K. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 474 ; 201-207

    Publication date:

    2008-01-01

    Size:

    7 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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