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    Thermomigration in solder joints

    New search for: Chen, C.
    New search for: Hsiao, H. Y.
    New search for: Chang, Y. W.
    New search for: Ouyang, F.
    New search for: Tu, K. N.

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    Thermomigration in solder joints

    New search for: Chen, C.
    New search for: Hsiao, H. Y.
    New search for: Chang, Y. W.
    New search for: Ouyang, F.
    New search for: Tu, K. N.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Thermomigration in solder joints

    New search for: Chen, C.
    New search for: Hsiao, H. Y.
    New search for: Chang, Y. W.
    New search for: Ouyang, F.
    New search for: Tu, K. N.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Thermomigration in solder joints

    Contributors:

    Chen, C. (author) / Hsiao, H. Y. (author) / Chang, Y. W. (author) / Ouyang, F. (author) / Tu, K. N. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING R REPORTS -LAUSANNE- ; 73 ; 85-100

    Publication date:

    2012-01-01

    Size:

    16 pages

    ISSN:

    0927-796X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.1 / 530

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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