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Review of methods to predict solder joint reliability under thermo-mechanical cycling

RIDOUT, S. / BAILEY, C.

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Review of methods to predict solder joint reliability under thermo-mechanical cycling

RIDOUT, S. / BAILEY, C.

Review of methods to predict solder joint reliability under thermo-mechanical cycling

RIDOUT, S. / BAILEY, C.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Review of methods to predict solder joint reliability under thermo-mechanical cycling

Contributors:

RIDOUT, S. (author) / BAILEY, C. (author)

Published in:

FATIGUE AND FRACTURE OF ENGINEERING MATERIALS AND STRUCTURES ; 30 ; 400-412

Publication date:

2007-01-01

Size:

13 pages

ISSN:

8756-758X

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1123

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