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A mathematical model for chemical-mechanical polishing based on formation and removal of weakly bonded molecular species
A mathematical model for chemical-mechanical polishing based on formation and removal of weakly bonded molecular species
A mathematical model for chemical-mechanical polishing based on formation and removal of weakly bonded molecular species
Zhao, Y. (author) / Chang, L. (author) / Kim, S. H. (author)
WEAR -LAUSANNE- ; 254 ; 332-339
2003-01-01
8 pages
Article (Journal)
English
DDC:
620.11292
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