A mathematical model for material removal and chemical-mechanical synergy in chemical-mechanical polishing at molecular scale

Bai, J. / Zhao, Y. W. / Wang, Y. G. | British Library Online Contents | 2007

Modeling effect of chemical-mechanical synergy on material removal at molecular scale in chemical mechanical polishing

Wang, Y. / Zhao, Y. / Jiang, J. et al. | British Library Online Contents | 2008

Multiscale material removal modeling of chemical mechanical polishing

Seok, J. / Sukam, C. P. / Kim, A. T. et al. | British Library Online Contents | 2003

Mechanical properties of weakly bonded cement stabilized kaolin

Lee, Kyu Hwan / Lee, Song | Springer Verlag | 2002

Material removal model for chemical-mechanical polishing considering wafer flexibility and edge effects

Seok, J. / Sukam, C. P. / Kim, A. T. et al. | British Library Online Contents | 2004