A mathematical model for material removal and chemical-mechanical synergy in chemical-mechanical polishing at molecular scale: Fid-Bau Portal

A mathematical model for material removal and chemical-mechanical synergy in chemical-mechanical polishing at molecular scale

Bai, J. / Zhao, Y. W. / Wang, Y. G.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

A mathematical model for material removal and chemical-mechanical synergy in chemical-mechanical polishing at molecular scale

Bai, J. / Zhao, Y. W. / Wang, Y. G.

A mathematical model for material removal and chemical-mechanical synergy in chemical-mechanical polishing at molecular scale

Bai, J. / Zhao, Y. W. / Wang, Y. G.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

A mathematical model for material removal and chemical-mechanical synergy in chemical-mechanical polishing at molecular scale

Contributors:

Bai, J. (author) / Zhao, Y. W. (author) / Wang, Y. G. (author)

Published in:

APPLIED SURFACE SCIENCE ; 253 ; 8489-8494

Publication date:

2007-01-01

Size:

6 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

Wang, Y. / Zhao, Y. / Jiang, J. et al. | British Library Online Contents | 2008

Multiscale material removal modeling of chemical mechanical polishing

Seok, J. / Sukam, C. P. / Kim, A. T. et al. | British Library Online Contents | 2003

A mathematical model for chemical-mechanical polishing based on formation and removal of weakly bonded molecular species

Zhao, Y. / Chang, L. / Kim, S. H. | British Library Online Contents | 2003

Material removal model for chemical-mechanical polishing considering wafer flexibility and edge effects

Seok, J. / Sukam, C. P. / Kim, A. T. et al. | British Library Online Contents | 2004

Modeling effects of abrasive particle size and concentration on material removal at molecular scale in chemical mechanical polishing

Wang, Y. / Zhao, Y. / An, W. et al. | British Library Online Contents | 2010