Fachinformationsdienst BAUdigital

A platform for research: civil engineering, architecture and urbanism

    Physical Properties of Plywood and Waferboard as Pile Cushion Materials

    New search for: Womack, K. C.
    New search for: Whitaker, A. M.
    New search for: Caliendo, J. A.
    New search for: Goble, G. G.
    New search for: Halling, M. W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Physical Properties of Plywood and Waferboard as Pile Cushion Materials

    New search for: Womack, K. C.
    New search for: Whitaker, A. M.
    New search for: Caliendo, J. A.
    New search for: Goble, G. G.
    New search for: Halling, M. W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Physical Properties of Plywood and Waferboard as Pile Cushion Materials

    New search for: Womack, K. C.
    New search for: Whitaker, A. M.
    New search for: Caliendo, J. A.
    New search for: Goble, G. G.
    New search for: Halling, M. W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Physical Properties of Plywood and Waferboard as Pile Cushion Materials

    Contributors:

    Womack, K. C. (author) / Whitaker, A. M. (author) / Caliendo, J. A. (author) / Goble, G. G. (author) / Halling, M. W. (author)

    Published in:

    JOURNAL OF GEOTECHNICAL AND GEOENVIRONMENTAL ENGINEERING ; 129 ; 379-382

    Publication date:

    2003-01-01

    Size:

    4 pages

    ISSN:

    1090-0241

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  624

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

    Similar titles

    Physical Properties of Plywood and Waferboard as Pile Cushion Materials

    Womack, Kevin C. | Online Contents | 2003

    Waferboard and OSB

    Dinwoodie, J. M. | TIBKAT | 1986

    An Innovative Stressed Skin Panel System Using Corrugated Waferboard

    Bach, L. / Cheng, J. J. R. / Canadian Society for Civil Engineering | British Library Conference Proceedings | 1995

    A New Type of Pile – Long with Cushion-Short without Cushion Rigid Pile

    Zhang, Ming-Fei / Yang, Guang-Hua / Wang, En-Qi | Tema Archive | 2012

    A New Type of Pile – Long with Cushion-Short without Cushion Rigid Pile

    Zhang, Ming Fei ;Yang, Guang Hua ;Wang, En Qi | Trans Tech Publications | 2012

    Back to top