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    An analysis of intermetallics formation of gold and copper ball bonding on thermal aging

    New search for: Murali, S.
    New search for: Srikanth, N.
    New search for: Vath III, C. J.

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    An analysis of intermetallics formation of gold and copper ball bonding on thermal aging

    New search for: Murali, S.
    New search for: Srikanth, N.
    New search for: Vath III, C. J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    An analysis of intermetallics formation of gold and copper ball bonding on thermal aging

    New search for: Murali, S.
    New search for: Srikanth, N.
    New search for: Vath III, C. J.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    An analysis of intermetallics formation of gold and copper ball bonding on thermal aging

    Contributors:

    Murali, S. (author) / Srikanth, N. (author) / Vath III, C. J. (author)

    Published in:

    MATERIALS RESEARCH BULLETIN ; 38 ; 637-646

    Publication date:

    2003-01-01

    Size:

    10 pages

    ISSN:

    0025-5408

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11 / 620

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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