Strong bonding of titanium to copper through the elimination of the brittle interfacial intermetallics: Fid-Bau Portal

Strong bonding of titanium to copper through the elimination of the brittle interfacial intermetallics

Lee, M.K. / Lee, J.G. / Lee, J.K. / Park, J.J. / Lee, G.J. / Uhm, Y.R. / Rhee, C.K.

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Strong bonding of titanium to copper through the elimination of the brittle interfacial intermetallics

Lee, M.K. / Lee, J.G. / Lee, J.K. / Park, J.J. / Lee, G.J. / Uhm, Y.R. / Rhee, C.K.

Strong bonding of titanium to copper through the elimination of the brittle interfacial intermetallics

Lee, M.K. / Lee, J.G. / Lee, J.K. / Park, J.J. / Lee, G.J. / Uhm, Y.R. / Rhee, C.K.

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Check availability in my library

Order at Subito €

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Document information

Title:

Strong bonding of titanium to copper through the elimination of the brittle interfacial intermetallics

Contributors:

Lee, M.K. (author) / Lee, J.G. (author) / Lee, J.K. (author) / Park, J.J. (author) / Lee, G.J. (author) / Uhm, Y.R. (author) / Rhee, C.K. (author)

Published in:

JOURNAL OF MATERIALS RESEARCH -PITTSBURGH THEN WARRENDALE- ; 23 ; 2254-2263

Publication date:

2008-01-01

Size:

10 pages

ISSN:

0884-2914

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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