Bonding of Copper to Aluminum Nitride Substrate Using Active Alloy Interlayer: Fid-Bau Portal

Bonding of Copper to Aluminum Nitride Substrate Using Active Alloy Interlayer

Bai, S. Q. / Chen, L. D. / Yamamura, A.

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Bonding of Copper to Aluminum Nitride Substrate Using Active Alloy Interlayer

Bai, S. Q. / Chen, L. D. / Yamamura, A.

Bonding of Copper to Aluminum Nitride Substrate Using Active Alloy Interlayer

Bai, S. Q. / Chen, L. D. / Yamamura, A.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Bonding of Copper to Aluminum Nitride Substrate Using Active Alloy Interlayer

Contributors:

Bai, S. Q. (author) / Chen, L. D. (author) / Yamamura, A. (author)

Published in:

MATERIALS SCIENCE FORUM ; 423/425 ; 301-304

Publication date:

2003-01-01

Size:

4 pages

ISSN:

0255-5476

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

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