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A comprehensive review of endpoint detection in chemical mechanical planarization for deep-submicron integrated circuits manufacturing
A comprehensive review of endpoint detection in chemical mechanical planarization for deep-submicron integrated circuits manufacturing
A comprehensive review of endpoint detection in chemical mechanical planarization for deep-submicron integrated circuits manufacturing
Hocheng, H. (author) / Huang, Y. L. (author)
INTERNATIONAL JOURNAL OF MATERIALS AND PRODUCT TECHNOLOGY ; 18 ; 469-486
2003-01-01
18 pages
Article (Journal)
English
DDC:
620.11
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