Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
A comprehensive review of endpoint detection in chemical mechanical planarization for deep-submicron integrated circuits manufacturing
A comprehensive review of endpoint detection in chemical mechanical planarization for deep-submicron integrated circuits manufacturing
A comprehensive review of endpoint detection in chemical mechanical planarization for deep-submicron integrated circuits manufacturing
Hocheng, H. (Autor:in) / Huang, Y. L. (Autor:in)
INTERNATIONAL JOURNAL OF MATERIALS AND PRODUCT TECHNOLOGY ; 18 ; 469-486
01.01.2003
18 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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