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    Development of a directly bonded aluminum/alumina power electronic substrate

    New search for: Ning, X. S.
    New search for: Lin, Y.
    New search for: Xu, W.
    New search for: Peng, R.
    New search for: Zhou, H.
    New search for: Chen, K.

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    Development of a directly bonded aluminum/alumina power electronic substrate

    New search for: Ning, X. S.
    New search for: Lin, Y.
    New search for: Xu, W.
    New search for: Peng, R.
    New search for: Zhou, H.
    New search for: Chen, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Development of a directly bonded aluminum/alumina power electronic substrate

    New search for: Ning, X. S.
    New search for: Lin, Y.
    New search for: Xu, W.
    New search for: Peng, R.
    New search for: Zhou, H.
    New search for: Chen, K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Development of a directly bonded aluminum/alumina power electronic substrate

    Contributors:

    Ning, X. S. (author) / Lin, Y. (author) / Xu, W. (author) / Peng, R. (author) / Zhou, H. (author) / Chen, K. (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING B -LAUSANNE- ; 99 ; 479-482

    Publication date:

    2003-01-01

    Size:

    4 pages

    ISSN:

    0921-5107

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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