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    Effects of Fourth Alloying Additives on Interfacial Microstructure of Sn-Ag-Cu Lead-Free Soldered Joints

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    New search for: Suganuma, K.
    New search for: Shimozaki, T.
    New search for: Lee, C. G.

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    Effects of Fourth Alloying Additives on Interfacial Microstructure of Sn-Ag-Cu Lead-Free Soldered Joints

    New search for: Kim, K. S.
    New search for: Suganuma, K.
    New search for: Shimozaki, T.
    New search for: Lee, C. G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Effects of Fourth Alloying Additives on Interfacial Microstructure of Sn-Ag-Cu Lead-Free Soldered Joints

    New search for: Kim, K. S.
    New search for: Suganuma, K.
    New search for: Shimozaki, T.
    New search for: Lee, C. G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Effects of Fourth Alloying Additives on Interfacial Microstructure of Sn-Ag-Cu Lead-Free Soldered Joints

    Contributors:

    Kim, K. S. (author) / Suganuma, K. (author) / Shimozaki, T. (author) / Lee, C. G. (author)

    Published in:

    Eco-Materials Processing and Design ; 7-11

    MATERIALS SCIENCE FORUM ; 439

    Publication date:

    2003-01-01

    Size:

    5 pages

    ISSN:

    0255-5476

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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