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    Interfacial microstructure, shear strength and electrical conductivity of Sn-3.5Ag-0.5In/Cu lead free soldered joints

    New search for: Kar, A.
    New search for: Ghosh, M.
    New search for: Majumdar, B.S.
    New search for: Ghosh, R.N.
    New search for: Ray, A.K.

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    Interfacial microstructure, shear strength and electrical conductivity of Sn-3.5Ag-0.5In/Cu lead free soldered joints

    New search for: Kar, A.
    New search for: Ghosh, M.
    New search for: Majumdar, B.S.
    New search for: Ghosh, R.N.
    New search for: Ray, A.K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Interfacial microstructure, shear strength and electrical conductivity of Sn-3.5Ag-0.5In/Cu lead free soldered joints

    New search for: Kar, A.
    New search for: Ghosh, M.
    New search for: Majumdar, B.S.
    New search for: Ghosh, R.N.
    New search for: Ray, A.K.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Interfacial microstructure, shear strength and electrical conductivity of Sn-3.5Ag-0.5In/Cu lead free soldered joints

    Contributors:

    Kar, A. (author) / Ghosh, M. (author) / Majumdar, B.S. (author) / Ghosh, R.N. (author) / Ray, A.K. (author)

    Published in:

    MATERIALS TECHNOLOGY ; 22 ; 161-165

    Publication date:

    2007-01-01

    Size:

    5 pages

    ISSN:

    1066-7857

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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