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Characteristics of sputtered TaBx thin films as diffusion barriers between copper and silicon
Characteristics of sputtered TaBx thin films as diffusion barriers between copper and silicon
Characteristics of sputtered TaBx thin films as diffusion barriers between copper and silicon
Lin, S. T. (author) / Kuo, Y. L. (author) / Lee, C. (author)
APPLIED SURFACE SCIENCE ; 220 ; 349-358
2003-01-01
10 pages
Article (Journal)
English
DDC:
621.35
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