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Characteristics of sputtered Ta-B-N thin films as diffusion barriers between copper and silicon

Lin, S. T. / Lee, C.

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Characteristics of sputtered Ta-B-N thin films as diffusion barriers between copper and silicon

Lin, S. T. / Lee, C.

Characteristics of sputtered Ta-B-N thin films as diffusion barriers between copper and silicon

Lin, S. T. / Lee, C.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Characteristics of sputtered Ta-B-N thin films as diffusion barriers between copper and silicon

Contributors:

Lin, S. T. (author) / Lee, C. (author)

Published in:

APPLIED SURFACE SCIENCE ; 253 ; 1215-1221

Publication date:

2006-01-01

Size:

7 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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