Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
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Characteristics of sputtered TaBx thin films as diffusion barriers between copper and silicon
Characteristics of sputtered TaBx thin films as diffusion barriers between copper and silicon
Characteristics of sputtered TaBx thin films as diffusion barriers between copper and silicon
Lin, S. T. (Autor:in) / Kuo, Y. L. (Autor:in) / Lee, C. (Autor:in)
APPLIED SURFACE SCIENCE ; 220 ; 349-358
01.01.2003
10 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
621.35
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