Chemical mechanical planarization of copper pH effect: Fid-Bau Portal

Chemical mechanical planarization of copper pH effect

Du, T. / Desai, V.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Chemical mechanical planarization of copper pH effect

Du, T. / Desai, V.

Chemical mechanical planarization of copper pH effect

Du, T. / Desai, V.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Chemical mechanical planarization of copper pH effect

Contributors:

Du, T. (author) / Desai, V. (author)

Published in:

JOURNAL OF MATERIALS SCIENCE LETTERS ; 22 ; 1623-1625

Publication date:

2003-01-01

Size:

3 pages

ISSN:

0261-8028

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11

Kulkarni, M. / Ng, D. / Baker, M. et al. | British Library Online Contents | 2007

Biosorption of copper (II) from chemical mechanical planarization wastewaters

Stanley, Leah C. | Online Contents | 2003

Electropotential-stimulated wear of copper during chemical mechanical planarization

Kulkarni, M. / Ng, D. / Baker, M. et al. | British Library Online Contents | 2007

Chemical roles on Cu-slurry interface during copper chemical mechanical planarization

Li, J. / Liu, Y. / Pan, Y. et al. | British Library Online Contents | 2014

Chemical roles on Cu-slurry interface during copper chemical mechanical planarization

Li, J. / Liu, Y. / Pan, Y. et al. | British Library Online Contents | 2014