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Chemical roles on Cu-slurry interface during copper chemical mechanical planarization

Li, J. / Liu, Y. / Pan, Y. / Lu, X.

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Chemical roles on Cu-slurry interface during copper chemical mechanical planarization

Li, J. / Liu, Y. / Pan, Y. / Lu, X.

Chemical roles on Cu-slurry interface during copper chemical mechanical planarization

Li, J. / Liu, Y. / Pan, Y. / Lu, X.

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

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Document information

Title:

Chemical roles on Cu-slurry interface during copper chemical mechanical planarization

Contributors:

Li, J. (author) / Liu, Y. (author) / Pan, Y. (author) / Lu, X. (author)

Published in:

APPLIED SURFACE SCIENCE ; 293 ; 287-292

Publication date:

2014-01-01

Size:

6 pages

ISSN:

0169-4332

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.35

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