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Thermo-Mechanical Failure Criterion at the Micron Scale in Electronic Devices
Thermo-Mechanical Failure Criterion at the Micron Scale in Electronic Devices
Thermo-Mechanical Failure Criterion at the Micron Scale in Electronic Devices
Yosibash, Z. (author) / Adan, O. (author) / Schneck, R. (author) / Atlas, H. (author)
INTERNATIONAL JOURNAL OF FRACTURE ; 122 ; 47-64
2003-01-01
18 pages
Article (Journal)
English
DDC:
620.1126
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