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Packaging Materials and Approaches for High Temperature SiC Power Devices

Johnson, R. W. / Palmer, M. / Wang, C. / Liu, Y.

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Packaging Materials and Approaches for High Temperature SiC Power Devices

Johnson, R. W. / Palmer, M. / Wang, C. / Liu, Y.

Packaging Materials and Approaches for High Temperature SiC Power Devices

Johnson, R. W. / Palmer, M. / Wang, C. / Liu, Y.

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Export, share and cite

Document information

Title:

Packaging Materials and Approaches for High Temperature SiC Power Devices

Contributors:

Johnson, R. W. (author) / Palmer, M. (author) / Wang, C. (author) / Liu, Y. (author)

Published in:

ADVANCING MICROELECTRONICS ; 31 ; 8-11

Publication date:

2004-01-01

Size:

4 pages

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 621.381

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