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A platform for research: civil engineering, architecture and urbanism
High Temperature Resistant Packaging for SiC Power Devices Using Interconnections Formed by Ni Micro-Electroplating
High Temperature Resistant Packaging for SiC Power Devices Using Interconnections Formed by Ni Micro-Electroplating
High Temperature Resistant Packaging for SiC Power Devices Using Interconnections Formed by Ni Micro-Electroplating
Kato, N. (author) / Shigenaga, A. (author) / Tatsumi, K. (author) / Okumura, H. / Harima, H. / Kimoto, T. / Yoshimoto, M. / Watanabe, H. / Hatayama, T. / Matsuura, H.
Silicon Carbide and Related Materials 2013 ; 1110-1113
MATERIALS SCIENCE FORUM ; 778/780
2014-01-01
4 pages
Article (Journal)
English
DDC:
620.11
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