A platform for research: civil engineering, architecture and urbanism
Electrochemical Kinetics Study of Electroless Copper Plating for Electronics Application
Electrochemical Kinetics Study of Electroless Copper Plating for Electronics Application
Electrochemical Kinetics Study of Electroless Copper Plating for Electronics Application
Kim, D. G. (author) / Bae, J. S. (author) / Lee, J. H. (author) / Kim, Y. D. (author) / Ahn, Y. M. (author) / Kang, S.-G. / Kobayashi, T.
2004-01-01
4 pages
Article (Journal)
English
DDC:
620.11
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Study of Electroless Plating Technology for Copper Hohlraum
British Library Online Contents | 2006
|Study of Electroless Copper Plating from Copper-glycerin Complex Soultion
British Library Online Contents | 2007
|Electroless Copper Plating Technology for Graphite Powder
British Library Online Contents | 2004
|Electroless Copper Plating Technology for Tungsten Powder
British Library Online Contents | 2004
|Electroless Copper Plating on Molybdenum Powder Surface
British Library Online Contents | 2008
|