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Study of Electroless Copper Plating from Copper-glycerin Complex Soultion

Wang, H.-x. / Zhao, H.-k.

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Study of Electroless Copper Plating from Copper-glycerin Complex Soultion

Wang, H.-x. / Zhao, H.-k.

Study of Electroless Copper Plating from Copper-glycerin Complex Soultion

Wang, H.-x. / Zhao, H.-k.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Study of Electroless Copper Plating from Copper-glycerin Complex Soultion

Contributors:

Wang, H.-x. (author) / Zhao, H.-k. (author)

Published in:

CORROSION SCIENCE AND PROTECTION TECHNOLOGY ; 19 ; 178-180

Publication date:

2007-01-01

Size:

3 pages

ISSN:

1002-6495

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 620.11223

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