A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
The grain shape dependence of springback of integrated circuit leadframes
The grain shape dependence of springback of integrated circuit leadframes
The grain shape dependence of springback of integrated circuit leadframes
Chan, K.C. (author) / Wang, S.H. (author)
MATERIALS SCIENCE AND ENGINEERING -LAUSANNE- A ; 270 ; 323 - 329
1999-01-01
7 pages
Article (Journal)
English
DDC:
620.11
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