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Thermomechanical Behavior of Underfill/Solder Mask/ Substrate Interface Under Thermal Cycling

Chien, C.-H. / Chen, Y.-C. / Hsieh, C.-C. / Chiou, Y.-T. / Wu, Y.-D. / Chen, T.-P.

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Thermomechanical Behavior of Underfill/Solder Mask/ Substrate Interface Under Thermal Cycling

Chien, C.-H. / Chen, Y.-C. / Hsieh, C.-C. / Chiou, Y.-T. / Wu, Y.-D. / Chen, T.-P.

Thermomechanical Behavior of Underfill/Solder Mask/ Substrate Interface Under Thermal Cycling

Chien, C.-H. / Chen, Y.-C. / Hsieh, C.-C. / Chiou, Y.-T. / Wu, Y.-D. / Chen, T.-P.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Thermomechanical Behavior of Underfill/Solder Mask/ Substrate Interface Under Thermal Cycling

Contributors:

Chien, C.-H. (author) / Chen, Y.-C. (author) / Hsieh, C.-C. (author) / Chiou, Y.-T. (author) / Wu, Y.-D. (author) / Chen, T.-P. (author)

Published in:

EXPERIMENTAL MECHANICS ; 44 ; 214-220

Publication date:

2004-01-01

Size:

7 pages

ISSN:

0014-4851

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1

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